Intel news roundup: chiplets milestone, server exit, and ARM deal

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Intel had a busy week. A trio of news announcements revealed its chiplets progress, a manufacturing agreement with Arm, and the shedding of another non-core line of business.

Prototype multi-die chips heading to DoD

The biggest news is that Intel has begun to ship prototype multi-die chips to the U.S. Department of Defense more than a year ahead of schedule. The DoD project known as State-of-the-Art Heterogeneous Integrated Packaging (SHIP) is an ambitious plan that will connect Intel’s CPUs, FPGAs, ASICs and government-developed chiplets all within the same processor packaging, as opposed to multiple separate dies.

AMD was the first to pursue the chiplet design, but AMD took a different approach in that it broke up large, monolithic CPUs into smaller chips. So, instead of one physical piece of silicon with 32 cores, it created four chiplets with eight cores each connected by high-speed interconnects. The idea is that it’s much easier to manufacture an eight-core chip than a 32-core chip.

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